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Ing. Jan Václavík, Ph.D.

Ing. Jan Václavík, Ph.D.
Institute of Mechatronics and Computer Engineering (MTI): Academic staff

E-mail:
jan.vaclavik@tul.cz
Office:
A01073
Tel.:
+420 48535 6823
STAG:
STAG profile
Specialisation
  • Research of new methods and principles for damping of noises and vibrations using piezoelectric patches or actuators connected to active or passive electronic circuits.
  • Development of electrical circuit for damping systems with high energetic efficiency.
  • Development of switched mode power supplies (10-1000W) for special applications (high voltage, high currents).
  • Research and development of thin films systems for optical and electrooptical applications including deposition methods (vacuum PVD).
  • Development of infrared systems for imaging and spectroscopic applications.
Publications
  • LUKEŠ, J. et al. Optically modified second harmonic generation in silicon oxynitride thin films via local layer heating Scientific Reports BERLIN: Springer Science and Business Media LLC, 2023, vol. 13, issue 1. P. neuvedeny (8 stran). ISSN: 2045-2322.
  • HLUBUČEK, J., LUKEŠ, J., VÁCLAVÍK, J. , and ŽÍDEK, K. Differential coded aperture single-snapshot spectral imaging Optics Letters WASHINGTON: Optica Publishing Group, 2022, vol. 47, issue 9. P. 2342 – 2345. ISSN: 0146-9592.
  • KANCLÍŘ, V., ŽÍDEK, K. , and VÁCLAVÍK, J. Precision of Silicon Oxynitride Refractive-Index Profile Retrieval Using Optical Characterization Acta Physica Polonica A 1. ed. Institute of Physics, Polish Academy of Sciences, 2021, vol. 140, issue 3. P. 215 – 221. ISSN: 0587-4246.
  • ČECH, J. et al. Robust System for Hyperspectral Imaging in the LWIR Spectral Region with Uncooled Thermal Detector Workshop on Hyperspectral Image and Signal Processing, Evolution in Remote Sensing IEEE, 2021 P. neuvedeny (4 stranky). ISBN: 978-1-6654-3601-4, ISSN: 2158-6276.
  • VÁCLAVÍK, J., NEČÁSEK, J., MOKRÝ, P. , and STEIGER, K. Active acoustic metasurface with an array of piezoelectric membranes and local control of acoustic impedance 25th International Congress on Sound and Vibration 2018, ICSV 2018: Hiroshima Calling 1. ed. Auburn, USA: International Institute of Acoustics and Vibration, IIAV, 2018 P. 555 – 561. ISBN: 978-1-5108-6845-8, ISSN: 2329-3675.

Topics of Student work
  • Softwarový model úběrové funkce procesu leštění optických ploch, MTI, 2026
Správa studentských prací a projektů
General partners
  • ČEZ
    ČEZ
  • Škoda Auto
    Škoda Auto
Partners
  • ABB
    ABB
  • Actis
    Actis
  • Adient
    Adient
  • INISOFT
    INISOFT
  • MicroNova
    MicroNova
  • T-MC66
    T-MC66
  • Unicorn
    Unicorn
  • ZF
    ZF
  • Centrum Radius
    Centrum Radius
Schools
  • SPŠ Česká Lípa
    SPŠ Česká Lípa
  • SPŠ a VOŠ Jičín
    SPŠ a VOŠ Jičín
  • SPŠ a VOŠ Liberec
    SPŠ a VOŠ Liberec
  • SOUS Škoda Auto
    SOUS Škoda Auto
  • SPŠ Mladá Boleslav
    SPŠ Mladá Boleslav
  • SPŠ Ústí nad Labem
    SPŠ Ústí nad Labem
  • SOŠ, SPŠ Varnsdorf
    SOŠ, SPŠ Varnsdorf